IBM, GF, Samsung, ST 4 simultaneous production 28nm chip giant

IBM GlobalFoundries, Samsung Electronics, STMicroelectronics, four giant, announced today that they will work together to achieve a synchronization of manufacturing facilities for semi-conductors, VW-VBG130 , use joint technology alliance of IBM 28nm technology development Low-power related to the production of chips.

It is understood that this synchronization model will ensure that the customer’s chip design may be more FABS in three countries within the flexible production, without having to redesign, greatly reducing the risk and cost of semiconductor manufacturing. Related to the new 28nm process has been distributed to the various common circuit factory is planned to plant this year there will be the first to complete the synchronization process, then we can start production soon.

IBM technology alliance is at the heart of IBM in East Fishkill, New York plant, including IBM, GlobalFoundries, Infineon, Renesas Technology, Samsung Electronics, STMicroelectronics and Toshiba. IBM GlobalFoundries, Samsung Electronics has developed a common platform alliance, overwhelmed one way or another STMicroelectronics to develop and implement standardization 28nm process.

IBM technology alliance 28nm low power process using bulk CMOS HKMG (metal gate high-K) of technology, dell Vostro 1220n battery
, particularly the potential through unique First Gate (front gate) technology to promote Standardization HKMG known in terms of flexibility and manufacturing are due to other types of technology HKMG (mainly Intel) chip smaller base, a more compatible design and production.

New technologies for the next generation of smart mobile devices, will become the cornerstone of a new generation of portable electronic products, widely used in streaming video, data, voice, social networks, mobile transactions and other areas.